00:00Why would AI make testing a chip earlier worth more?
00:03eHerr Test Systems gives a reason.
00:06In eHerr Test Systems, account, high-bandwidth memory combines multiple DRAM die using through-silicon connections.
00:15The company says one defective die can compromise the entire valuable stack.
00:21eHerr believes it's wafer-level testing, and Burnin can find latent defects before stacking and packaging, when screening is more
00:29useful.
00:30Watch the full breakdown, tap the related video.
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