00:00Y1 company's chip roadmap sets the pace for the entire AI industry.
00:06Yet faster chips expose another constraint, the memory wall.
00:10Across roughly two decades, research by Galami and colleagues
00:14found peak server compute growing about three times every two years,
00:19while DRAM bandwidth grew only 1.6 times.
00:23The arithmetic units can therefore finish work faster than memory can deliver the next data,
00:28leaving inference waiting on movement rather than computation.
00:33HBM attacks that gap by stacking memory beside the accelerator and widening the path.
00:40HBM3 e-ships in 8- and 12-layer configurations.
00:45HBM4 includes 12- and 16-layer designs.
00:49That makes suppliers such as SK Hynix, Micron, and Samsung part of the compute bottleneck itself.
00:56Counterpoint estimated SK Hynix held about 58.0% of the global HBM market in early 2026,
01:06while Micron supplies the same scarce memory needed to keep NVIDIA and AMD accelerators busy.
01:14Watch the full breakdown, tap the related video.
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