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00:02Samsung Electronics said it signed a memorandum of understanding with Broadcom to expand
00:07cooperation in memory chips, contract chip manufacturing, and advanced packaging through
00:112030, according to Reuters. Samsung said the collaboration is expected to exceed $200 billion
00:18over the period. The company said they will combine Broadcom's application-specific
00:22integrated circuit design expertise with Samsung's manufacturing capabilities.
00:26The agreement includes production of Broadcom's next-generation communications chips using
00:32Samsung's sub-2 nanometer process technology and joint development of next-generation high-bandwidth
00:38memory products. The company said the agreement could strengthen its foundry business as it seeks
00:44more advanced 2 nanometer orders and expands long-term relationships with major technology
00:48customers. For all things money, visit Benzinga.com.
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