00:00AMD has unveiled its next generation CPU, codenamed VENIS, which will be manufactured using TSMC's advanced 2nm process node.
00:10This chip is designed for EPYC server processors, 6th generation, and marks the industry's first high-performance computing, HPC chip,
00:21built on 2nm technology.
00:23Key Highlights
00:24Performance Leap
00:26The VENIS CPU offers up to 256 cores and a memory bandwidth of 1.6 terabytes per second, delivering 1
00:34.7 times the performance of the previous Turin generation.
00:38New transistor architecture, TSMC's 2nm, N2, process moves from FINFAT to gate-all-around, GAA, nanosheet transistors, which provide better
00:51control over power leakage and improved efficiency.
00:54AI Focus
00:55According to AMD CEO Dr. Lisa Su, this chip is a major step forward for next-generation AI infrastructure, enabling
01:04faster data processing in data centers.
01:06Production and Roadmap
01:09Production and Roadmap
01:09Initial production is underway in Taiwan, with plans to also manufacture at TSMC's new facility in Arizona, USA.
01:18AMD has also planned another 2nm CPU called Verano for the data center market.
01:24This collaboration between AMD and TSMC pushes the limits of semiconductor technology, promising faster, more energy-efficient processors for servers
01:35and AI workloads.
Comments