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Samsung Electronics plans to more than double next year’s production volume of 6th-generation HBM4 and 7th-generation HBM4E compared to this year, and expand its glass carrier production by 2.5 times to prevent warping in high-layer-count modules. We take a closer look at Samsung Electronics’ strategic move to regain market leadership by increasing the share of its next-generation HBM4 series to 80%.
#SamsungElectronics #HBM4 #HBM4E #GlassCarrier #AISemiconductor

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00:00Next year, one-third of DRAM production capacity is expected to be allocated to HBM.
00:05Now, HBM is essentially changing the game in the DRAM market in a projection shared with Reuters
00:11by an executive from Samsung Electronics Memory Business.
00:14The proportion of waffers for HBM, which is currently about 20%, is expected to rise to 30% next year.
00:22With the HBM market growing like this, competition between Samsung's electronics and SK Hinnix
00:29is also getting fiercer. SK Hinnix was ahead up to HBM 3E, but with the shift to HBM 4,
00:35Samsung Electronics is quickly catching up. In fact, in terms of recent HBM revenue,
00:40share SK Hinnix has dropped to 50%, while Samsung Electronics has risen to 33%.
00:46Some brokerage firms also projected that next year, Samsung Electronics will surpass SK Hinnix
00:52in terms of its share of HBM shipments. We'll have to see whether Samsung Electronics can take the lead,
00:58this time in the HBM market, that AI has helped grow.

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