00:00Taiwan's TSMC is pushing to build five more advanced packaging plants,
00:05even before its current facilities are finished, Taiwanese media reported, citing sources.
00:11These are chip-on-wafer-on-substrate factories that stack and bond chips together.
00:16At the Southern Taiwan Science Park, Plant 1 is already in mass production,
00:21while Plant 2 is being equipped.
00:23Plants 3 through 5 are targeted for completion before 2031.
00:28Add five more, and a single campus would house 10 facilities,
00:32the largest advanced packaging complex in the world.
00:34So why the rush?
00:36Sources say demand for co-wasp packaging from NVIDIA, AMD, and Apple has outpaced supply,
00:42pushing TSMC to expand before losing customers.
00:46Simply put, there aren't enough bonding lines to go around.
00:49That said, nothing is finalized.
00:51The plan still requires a one-month public consultation, cabinet review,
00:55and an environmental impact assessment before moving forward.
00:58MUN Nakamura
00:58FOSP
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