Samsung to Double HBM4 and HBM4E Output Next Year | September 21 2026 | Front Page Daily - 동영상 Dailymotion

Seoul Economic Daily

Episode Description: Samsung Electronics just laid out a plan to double its most advanced AI memory chip output next year. Samsung Electronics plans to raise average monthly HBM4 and HBM4E production to 250,000 units next year, with sixth and seventh-generation chips making up more than 80% of the mix. The company is also weighing HBM4 stacks of up to 165 layers, while glass-carrier substrate demand tied to the ramp-up is expected to grow 2.5 times. Separately, a survey of 20 foreign exchange experts pointed to the won settling in the 1,300-to-1,350 range against the dollar in the near term. Together, the stories point to a strengthening chip cycle alongside a steadier currency backdrop.  Sources: - Samsung Electronics to Double HBM4, HBM4E Production Next Year — Seoul Economic Daily, September 21, 2026 - FX Experts See Won Settling Near 1,300–1,350 Range — Seoul Economic Daily, September 21, 2026  About AI PRISM: AI PRISM is Seoul Economic Daily's WAN-IFRA award-winning newsroom AI series, delivering Korean economic news adapted for global audiences. Episodes are produced with AI assistance and reviewed by a human editor.  Tags: #Samsung #HBM4 #AIMemoryChips #KoreanWon #KoreaEconomy #KOSPI #AIPRISM #SeoulEconomicDaily #WANIFRA

Transcript

00:02다음 주에 만나요.

00:05한글자막 제공 및 자막 제공 및 자막 제공 및 광고를 포함하고 있습니다.

00:08한국의 전공 및 광고를 포함하고 있습니다.

00:13다음 주에 만나요.

00:15다음 주에 만나요.

00:16약 250,000 유닛이 있습니다.

00:176th and 7th generation HBM

00:20더 80%의 그 mix이 있습니다.

00:24삼성 Electronics briefed the market on its roadmap for high-bandwidth memory chips used in AI servers.

00:30The plan covers a sharp ramp-up in glass-carrier substrate demand alongside the production increase.

00:36Foreign exchange analysts separately flagged the WAN's likely path in a related briefing on the same page.

00:41Here's what the numbers show.

00:43250,000 units.

00:45That's Samsung's projected average monthly HBM output for next year.

00:49Roughly double current levels.

00:526th and 7th generation HBM chips will account for more than 80% of that volume.

00:57Samsung is also weighing HBM4 stacks of up to 165 layers and HBM4E designs beyond 12 layers.

01:06Glass-carrier substrate demand tied to this ramp-up is expected to grow 2.5 times.

01:11Separately, 20 foreign exchange experts surveyed by the paper

01:14mostly see the WAN settling in the 1,300 to 1,350 range against the dollar.

01:21So, what does this mean for global readers following Korea's economy?

01:26Earlier, we said Samsung is doubling its HBM4 and HBM4E output for next year.

01:32Here's what that actually means for you.

01:34Korea's AI memory supply chain is scaling up well ahead of next year's demand curve, reinforcing Samsung's position against rivals.

01:43A steadier, moderately stronger WAN adds another tailwind for exporters riding that chip cycle.

01:48Samsung's HBM4 qualification results with major AI chip makers.

01:54Glass-carrier substrate supplier announcements tied to the 2.5 times demand jump.

01:59Whether the WAN holds in the 1,300 to 1,350 range as forecasters expect.

02:06That's today's AI Prism, Front Page Daily.

02:09This episode was produced with AI Assistants based on Seoul Economic Daily reporting and reviewed by a human editor.

02:16AI Prism is a WANIFRA award-winning series.

02:19We'll be back tomorrow.

02:20We'll be back tomorrow.

02:21We'll be back tomorrow.

02:22We'll be back tomorrow.

Samsung to Double HBM4 and HBM4E Output Next Year | September 21 2026 | Front Page Daily

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