Chip Removal: The CPU or BGA chip is carefully heated and removed from the motherboard.
Cleaning: All old solder is cleaned off both the chip and the motherboard using solder wick and flux.
Reballing: New solder balls are placed on the chip using a stencil. These balls are then melted onto the chip using a reflow station or reballing machine.
Reinstallation: The reballed chip is re-aligned and soldered back onto the motherboard using heat to reflow the new balls and establish a solid connection
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