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    TI demonstrates Blaze™ MDP

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    MultiVu

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    Forging new pathways to the mobile future, Texas Instruments Incorporated (TI) (NYSE: TXN) today highlighted how its OMAP™ 4 platform spurs some of the industry's most sophisticated user experiences with capabilities that transform how consumers connect to the world and with their mobile devices. Delivering the performance and flexibility of a computing platform and meeting the frugal power requirements of a mobile solution, the OMAP 4 platform, sampling today, is being showcased this week in TI's Mobile World Congress 2010 booth (8A84, Hall 8). For more information, visit: www.ti.com/omap4-pr. To view Multimedia News Release, go to http://multivu.prnewswire.com/mnr/ti/39154/